In the electronics industry, the high temperatures generated during the drilling process can cause the prepreg to melt and form smears. These smears not only compromise product quality and performance but can also hinder subsequent production processes. Therefore, finding an effective method for removing these smears is crucial.

The alkaline Potassium Permanganate/Sodium Permanganate method is widely used for this purpose. Its core principle lies in the strong oxidizing property of permanganate. Under high temperature and strong alkaline conditions, permanganate chemically reacts with the resin, dissolving and removing the smear.

This method is effective because it not only removes the smear efficiently but also creates an ideal micro-roughness on the hole wall. This roughness enhances the bonding between the substrate and the metal, thereby improving the overall performance of the product. Additionally, the method offers the advantage of electrolytic regeneration, allowing for some degree of resource recycling and reduced production costs.

Economically and in terms of stability, the alkaline Potassium Permanganate/Sodium Permanganate method also excels. It does not require expensive equipment or complex operating processes, keeping costs relatively low. Furthermore, since the reaction conditions are mild and easy to control, the method is highly stable, ensuring the continuity and consistency of the production process.

Currently, most PCB manufacturers opt for this method to remove glue residue. This choice is driven not only by its efficiency and cost-effectiveness but also by its ability to meet the high-quality and stability requirements of PCB production.